Pioneering OSP Solutions for Enhanced PCB Performance

What is OSP?

OSP, or Organic Solderability Preservative, is a specialized chemical coating applied to the surface of copper on a PCB (Printed Circuit Board). It forms a thin, protective film to prevent copper from rusting or corroding during storage. The ideal thickness for OSP is between 0.2 to 0.5 micrometers. Understanding the meticulous process behind OSP (Organic Solderability Preservative) is essential for ensuring the quality and reliability of your PCBs. Explore our OSP production flowchart to see how we protect your circuit boards.